The sensors are based one an advanced “bulk micro machined” MEMS technology.
The three dimensional structure (3D MEMS) of these sensors comprise a pendulum
made of mono crystalline silicon. The pendulum is hermetically enclosed between two
silicon discs. From this construction results a long term stable, high resolution und
shock resistant sensor. A gas damping prevents overshooting and interfering
resonance oscillation. The movement of the pendulum is measured capacitive by an
ASIC. • senses in positive and negative direction • high repeatability up to 0,01% over range • high resolution: up to 0,001% over range • shock resistance of the pendulum min. 50’000g • temperature range -40 .. +125°C • active and passive temperature compensation • 16x11x5 mm DIL12-pin in housing for SMD mounting • wide wanted signal: 0.5… 4.5V output over measuring range
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