The sensors are based one an advanced “bulk micro machined” MEMS technology. The three dimensional structure (3D MEMS) of these sensors comprise a pendulum made of mono crystalline silicon. The pendulum is hermetically enclosed between two silicon discs. From this construction results a long term stable, high resolution und shock resistant sensor. A gas damping prevents overshooting and interfering resonance oscillation. The movement of the pendulum is measured capacitive by an ASIC.
• senses in positive and negative direction
• high repeatability up to 0,01% over range
• high resolution: up to 0,001% over range
• shock resistance of the pendulum min. 50’000g
• temperature range -40 .. +125°C
• active and passive temperature compensation
• 16x11x5 mm DIL12-pin in housing for SMD mounting
• wide wanted signal: 0.5… 4.5V output over measuring range